1) Which of the following statement is/are TRUE. a) The OEE allows us to identify waste, classifying them in order to plan action of improvement b) The OEE provide solution to the problem identified c) The OEE is a complete with a target value 2) What are the elements of Overall Equipment Effectiveness? a) Machine Availability (MA) b) Manufacturing Efficiency (ME) c) Yield d) Wafer per Hour (WPH) 3) MA, ME and Yield are the term used in Longi Malaysia to represent OEE elements. Which of the following is the correct global standard term of OEE elements? a) MA-Availability; ME-Performance; Yield-Output b) MA-Availability; ME-Effectiveness; Yield-Output c) MA-Availability; ME-Effectiveness; Yield-Quality 4) Scheduled maintenance influence OEE. In order to improve OEE, we can directly reduce scheduled maintenance activities. a) True b) False 5) Machine A is pending WIP. EQP is utilizing the time to carry out scheduled maintenance. The machine is under which EQP state?  a) UDT b) SDT c) ENG Time d) PRD 6) EQP Team is troubleshooting on robot arm issues of Machine A. Manufacturing team utilizing the time to do 6S. The machine is under which EQP state? a) SDT b) NST c) UDT d) SBY 7) The EQP Team is carrying out scheduled maintenance on Machine A during stock count period. The machine is under which EQP state? a) SDT b) UDT c) SBY d) NST 8) Process Team had come out with new recipe. They need to clear out all wafer and stop the machine to set up this new recipe. The machine is under what EQP state? a) PRD b) UDT c) SBY d) ENG 9) Machine A just released to production after maintenance. The first few batch of the process will naturally be load only mode. Before it reach to its ideal TWPH, what is the EQP state of the machine? a) ENG b) UDT c) PRD d) SBY 10) Operators are requested to wipe printer screen due to spike of broken finger issue a) SBY b) UDT c) SDT d) ENG

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